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[QUOTE="Munyaradzi Mafaro, post: 35768, member: 636"]
OKI Circuit Technology has created new 124-layer printed circuit boards for testing equipment used with next-generation memory chips in AI systems. The company added about 15 percent more layers compared to the standard 108-layer designs. They plan to start mass production at their Joetsu Plant in Japan around October 2025. This factory already makes complex, precise circuit boards for testing computer chips.

AI systems need to move massive amounts of data between graphics processors and memory. As chips become more powerful, they require faster memory that can handle more information. High bandwidth memory uses stacked chips, which must be made thinner with greater precision. The testing equipment for these parts needs better circuit boards.

Modern chips process huge numbers of signals with more components packed onto smaller wafers, requiring denser circuit boards with more layers. However, board thickness cannot exceed 7.6 mm because of various limits. OKI solved this problem by developing ultra-thin materials and special tools to handle them. They also created an automatic transport system for these delicate materials.

OKI provides complete manufacturing services from design through production and testing. The company focuses on developing technology for growing markets like AI chips, aerospace, defense, robots, and new communication systems. From April 30 to May 2, OKI will show its latest technology at PCB East 2025 in Massachusetts.
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