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[QUOTE="Munyaradzi Mafaro, post: 33585, member: 636"]
New chip-making equipment costs $380 million but might save money overall. IBM researchers showed that High-NA equipment costs 2.5 times more per exposure than standard machines. These savings appear when the technology replaces complex multi-step processes. SemiAnalysis changed its prediction after seeing the new data from February tests. The research confirms that standard double patterning remains cheapest for simple patterns.

The math changes when manufacturers need three or more exposures with standard equipment. One high-NA pass can cut total wafer costs almost in half compared to traditional four-mask methods. Factories like fewer exposures because they simplify production steps, reduce waiting time, and decrease error chances. However, not every layer benefits from the expensive new system. Only certain metal layers in Intel 14A chips make financial sense for high-NA use.

Intel stands alone among major chipmakers with plans for high-NA production. Equipment maker ASML is working on larger masks to improve speed and efficiency. Chip companies must consider many factors before investing in the technology. Intel has already processed 30,000 test wafers using ASML Twinscan EXE:5000 high-NA systems. Final results about high-NA practicality will come once Intel moves to full production.
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