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Message: [QUOTE="Munyaradzi Mafaro, post: 73220, member: 636"] Google may tap Intel's packaging capabilities for its ninth-generation tensor processing units slated for market entry within two years, according to industry analysts tracking the American chipmaker's foundry expansion efforts. Meta's machine learning infrastructure accelerators could similarly adopt the embedded multi-die interconnect bridge technology that Intel has refined through successive server processor generations. The California manufacturer stands alone as the domestic supplier of sophisticated chip assembly methods while Taiwan Semiconductor Manufacturing Company gradually relocates comparable services stateside. Graphics processor vendors have exhausted much of the Taiwanese foundry's capacity, pushing custom silicon designers toward Intel's alternative solutions for three-dimensional integration and high-bandwidth connections between dies. [/QUOTE]