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Message: [QUOTE="Queen, post: 85037, member: 27"] Intel just waved a glass-based monster package at the industry, basically saying the glass substrate rumors were wildly premature. Intel shows it is not done with glass [LIST] [*]Intel rolled up to NEPCON Japan with something loud. [*]The company showed off a thick glass substrate fused with EMIB. [*]This is aimed straight at data center and HPC-class silicon. [/LIST] Where this showed up [LIST] [*]The demo came from Intel Foundry. [*]It was presented at NEPCON Japan. [*]Intel framed it as a first-of-its-kind implementation. [/LIST] Why this matters right now [LIST] [*]Recent chatter said Intel had quietly backed off from glass substrates. [*]That talk picked up after some key departures. [*]This demo pretty much shuts that rumor down. [/LIST] What Intel actually built [LIST] [*]The design combines EMIB with a thick glass core. [*]The package size lands at 78 mm by 77 mm. [*]Intel says this enables a two-times reticle-scale design. [*]Translation: this thing is built for huge silicon assemblies. [/LIST] The stack is dense and wild [LIST] [*]The structure follows a 10-2-10 layout. [*]Ten redistribution layers on top. [*]A two-layer glass core in the middle. [*]Ten build-up layers underneath. [*]Even with all that density, wiring stays tight because glass behaves better than organic substrates. [/LIST] Chiplets are the whole point [LIST] [*]Intel already dropped two EMIB bridges into the package. [*]Those bridges link multiple compute dies. [*]This is clearly a multi-chiplet GPU-style configuration. [/LIST] Who this is really for [LIST] [*]The footprint screams server hardware. [*]The No SeWaRe label points to data center deployments. [*]Think AI accelerators and HPC silicon, not consumer CPUs. [/LIST] Why glass is the secret sauce [LIST] [*]Glass allows finer interconnects. [*]Depth-of-field control improves. [*]Mechanical stress drops compared to organic substrates. [*]All of that helps when you want absurdly large chiplet counts. [/LIST] Why EMIB keeps coming up [LIST] [*]EMIB is getting a lot of attention in HPC circles. [*]Advanced packaging supply chains are tight right now. [*]Intel is leaning hard into this opening. [/LIST] The bigger Intel play [LIST] [*]Advanced packaging is shaping up as a revenue angle. [*]Intel Foundry clearly wants in on that. [*]Glass substrates paired with EMIB look like a long-term bet, not a side project. [/LIST] The takeaway [LIST] [*]Intel did not shelve glass substrates. [*]It doubled down and brought receipts. [*]If AI chips keep growing sideways instead of up, this kind of packaging is where the fight moves next. [/LIST] [/QUOTE]

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