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[QUOTE="Munyaradzi Mafaro, post: 36283, member: 636"]
Intel moves ahead with its next chips. CEO Lip-Bu Tan shared updates about new chip-making plans. The company tests 14A chips running at 1.4nm with several customers. These chips feature better PowerDirect technology for more power to parts that need it. Intel might beat others using high-NA EUV tools before TSMC plans similar tech in 2028.

The 18A chips enter risk production before mass production starts this year. Workers also make 18A-P chips for better speed. Another version, 18A-PT, will use Foveros Direct 3D tech to stack parts. This packs more connections inside chips for a smaller size but more power. The stacking method helps Intel compete with AMD and TSMC offerings.

The company adds new packaging called EMIB-T for chips needing fast memory. Two new Foveros versions give computer makers more choices. Intel wants to serve customers who need super-fast computers. These changes help Intel catch up with computer chip rivals. The company hopes these steps bring back its lead in chip making.
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