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[QUOTE="Munyaradzi Mafaro, post: 77018, member: 636"]
Apple might switch up how it packages the chips inside next year's iPhone 18 lineup by moving from InFO to WMCM tech, and some Weibo leaker says this could actually help with heat management way more than people realize. The new packaging splits the CPU, GPU, and NPU into separate dies instead of cramming everything onto one piece of silicon, which apparently cuts down on power consumption since each component does its own thing independently.

The vapor chamber cooling that debuted in the iPhone 17 Pro models will stick around for the flagship phones and supposedly show up in the foldable iPhone that might drop alongside the regular releases. Combined with the 2nm manufacturing process from TSMC, the A20 chips could deliver better sustained performance than current-generation processors.

The A19 Pro already outperforms the Snapdragon 8 Elite Gen 5 in gaming tests even when the Qualcomm chip has active cooling strapped to it, so the iPhone 18 series could be pretty wild if these rumors pan out.
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