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[QUOTE="Munyaradzi Mafaro, post: 34186, member: 636"]
Memory industry group JEDEC released its new HBM4 standard for computer memory. The upgraded design builds on previous HBM3 technology but transfers data much faster. These improvements help systems handle large datasets better, especially for artificial intelligence programs.

HBM4 moves information at speeds up to 8 gigabits per second across a wide connection path. This design doubles the number of channels from 16 to 32 compared to earlier versions. The new standard works with lower power settings, making it more energy efficient than before. Companies can use both HBM3 and HBM4 with the same controllers because they remain compatible.

Major tech companies praised the development. AMD, Google Cloud, Meta, Micron, Samsung, and SK Hynix all mentioned how important this standard will become for their future products. They believe HBM4 will power next-generation computing systems, particularly for AI tasks that need massive memory bandwidth.

The memory can be stacked in different configurations with die densities of 24 or 32 gigabits. This allows for higher capacity options, reaching up to 64 gigabytes in a single stack. JEDEC created these specs through collaboration between many technology companies.
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