LG Debuts AI Data Center Cooling Tech at DCW 2025

LG Electronics showed off new cooling products at Data Center World 2025 in Washington, D.C. The company brought chillers, server cooling systems, and its Building Energy Control solution to the event. These products aim to help manage heat from AI data centers that run hotter than regular ones. LG wants to expand into North America with these high-tech cooling options. The company says its combined approach handles both chip cooling and room cooling needs.

LG featured direct-to-chip technology that cools server chips with liquid. Their Coolant Distribution Unit controls temperature and flow to save energy. It has a touchscreen interface and backup systems to keep running if problems occur. The company also introduced Cold Plates that attach directly to high-powered chips. These plates use special designs to maximize cooling and minimize leaks.

Chillers have become important for AI facilities because they cool very effectively. LG makes water-cooled models with magnetic bearings that work without oil lubricants. Their air-cooled chillers can switch between mechanical and free-cooling modes depending on conditions. The company created a test lab to develop better cooling products based on real-world simulations.
 

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