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[QUOTE="Munyaradzi Mafaro, post: 55314, member: 636"]
NVIDIA explores Chip-on-Wafer-on-Platform technology for future Rubin graphics processors according to leaked roadmaps. The company currently relies on Chip-on-Wafer-on-Substrate packaging for artificial intelligence chips but seeks improved performance through alternative methods. CoWoP eliminates package substrates by connecting interposers directly to motherboards. This approach delivers enhanced signal integrity, superior power distribution, and better thermal management through direct die contact. The technology also reduces manufacturing costs by removing package lids and substrates.

Testing begins with GB100 dummy units measuring 110x110mm this month before advancing to functional variants in August. NVIDIA plans Rubin chip integration during 2026 with production readiness expected by late 2026 or early 2027. The GR100 CoWoP serves as the foundation for the commercial GR150 Rubin solution. However, implementation challenges exist regarding supply chain establishment and motherboard design modifications. Morgan Stanley analysts express skepticism about widespread CoWoP adoption despite potential technical advantages over traditional packaging methods.
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