Japan's NEDO just approved Rapidus Corporation's plans and budget for 2025. The approval covers two big projects about making advanced 2-nanometer chips. These projects focus on cutting-edge semiconductor technology and faster production times. They also include work on chiplet design and packaging for these tiny, powerful chips.
Rapidus started the first project back in 2022. They built a manufacturing center called IIM in Chitose, Hokkaido. Their engineers traveled to IBM in America to learn how to mass-produce these advanced chips. The company installed special EUV machines and started running their clean room. They met all their targets for last year.
The second project began in March 2024. It aims to create larger chiplet packages that save power. Rapidus works with partners around the world - IBM from America, Fraunhofer from Germany, and A*STAR IME from Singapore. They picked their basic process steps and chose equipment last year. The company decided to build a new research center next to their main plant.
April brings the start of their pilot production line using equipment already set up. Engineers will make test versions of advanced GAA transistors on 300mm wafers. Rapidus plans to give early customers special design tools and wants companies to start trying out prototypes soon. The manufacturing equipment goes into their new RCS facility next month.
The team will create special connection layers between chips. They plan to develop 3D packaging methods and design kits for advanced assembly. Quality testing remains important - they need ways to identify good chips before final assembly. Their CEO, Dr. Atsuyoshi Koike, thanked many groups for helping them reach this point. He said the IIM building project moved forward smoothly. The pilot line starting in April should lead to mass production by 2027.
Rapidus started the first project back in 2022. They built a manufacturing center called IIM in Chitose, Hokkaido. Their engineers traveled to IBM in America to learn how to mass-produce these advanced chips. The company installed special EUV machines and started running their clean room. They met all their targets for last year.
The second project began in March 2024. It aims to create larger chiplet packages that save power. Rapidus works with partners around the world - IBM from America, Fraunhofer from Germany, and A*STAR IME from Singapore. They picked their basic process steps and chose equipment last year. The company decided to build a new research center next to their main plant.
April brings the start of their pilot production line using equipment already set up. Engineers will make test versions of advanced GAA transistors on 300mm wafers. Rapidus plans to give early customers special design tools and wants companies to start trying out prototypes soon. The manufacturing equipment goes into their new RCS facility next month.
The team will create special connection layers between chips. They plan to develop 3D packaging methods and design kits for advanced assembly. Quality testing remains important - they need ways to identify good chips before final assembly. Their CEO, Dr. Atsuyoshi Koike, thanked many groups for helping them reach this point. He said the IIM building project moved forward smoothly. The pilot line starting in April should lead to mass production by 2027.
