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[QUOTE="Munyaradzi Mafaro, post: 36554, member: 636"]
Samsung lags behind rivals in making newer memory chips for AI machines this year. Most news about High-Bandwidth Memory has focused on SK Hynix and Micron products instead of Samsung. Financial reports show Samsung engineers still work on improved HBM3E chips, as competitors already display next-generation HBM4 memory. The company plans to sell more enhanced HBM3E 12H products soon, but has lost ground to other makers in the AI chip market.

According to industry experts, Samsung wants to win back customers after 2025. Memory department VP Kim Jae-joon told analysts the company works with many clients on special versions of both HBM4 and HBM4E. If factories begin making these chips later this year, these chips should start shipping to buyers in 2026. Kim said development stays on track with the planned schedule. South Korean news reports claim Samsung has already sent test samples to NVIDIA, Broadcom, and Google.

Tech website Wccftech thinks Samsung might succeed with its strategy. The company uses its 4 nm manufacturing process and advanced 10 nm sixth-generation DRAM technology for these memory chips. Early review suggests Samsung HBM4 matches what competitors offer, but final performance remains unknown. Time will tell if Samsung can regain its position in this important market.
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