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[QUOTE="Munyaradzi Mafaro, post: 36131, member: 636"]
SK Hynix showed off its new HBM4 memory at TSMC's North America Technology Symposium. The company leads other manufacturers with a ready commercial version of HBM4, as competitors still work on samples.

The new HBM4 offers up to 48 GB capacity with 2.0 TB/s bandwidth running at 8.0 Gbps. SK Hynix plans to start mass production in the second half of 2025. Products using this memory might appear as early as year-end. They currently stand as the only company that has publicly displayed HBM4.

SK Hynix also presented its 16-layer HBM3E memory with 1.2 TB/s bandwidth. NVIDIA plans to use this memory in GB300 "Blackwell Ultra" AI systems before moving to HBM4 with future products. The company connects these many layers through Advanced MR-MUF and TSV technology.

Their exhibit featured server memory modules built on the newer 1C DRAM standard, reaching speeds up to 12,500 MB/s. These modules aim to boost AI and data center performance with reduced power needs. The MRDIMM lineup runs at 12.8 Gbps with capacities from 64 GB to 256 GB.

SK Hynix has gained an advantage in the memory market through innovation and partnerships with companies like NVIDIA. With these advancements, they have moved ahead of traditional market leaders such as Samsung.
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