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Message: [QUOTE="Munyaradzi Mafaro, post: 39641, member: 636"] TSMC faces significant challenges with advanced chip packaging due to supply shortages from a key Japanese supplier. Asahi Kasei manufactures photosensitive polyimide materials that contribute to the development of CoWoS packaging technology. The Japanese company can no longer meet the huge demand from artificial intelligence hardware makers. CoWoS packaging enables companies like NVIDIA to design and build powerful computer processors for AI applications. Multiple chip pieces stack together to create faster performance than single processors alone. Asahi KASEI will choose which customers receive limited supplies of their special materials first. The shortage could force NVIDIA and other chipmakers to adjust their production schedules or raise prices. Taiwan Economic Daily reported that advanced packaging production might slow down across the industry. Companies that depend on these materials face delays in shipping new AI hardware to customers. The Japanese supplier plays a crucial role throughout the entire AI manufacturing process. TSMC works closely with Asahi KASEI and might receive priority treatment for material deliveries over competitors. Other packaging companies, such as ASE Technology, Samsung, and Intel, could experience worse supply chain problems. NVIDIA CEO Jensen Huang previously stated that his company relies entirely on TSMC CoWoS technology. The graphics chip maker has no backup plans for switching to different packaging partners. TSMC must quickly figure out how to handle these supply chain challenges. [/QUOTE]

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