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[QUOTE="Munyaradzi Mafaro, post: 36136, member: 636"]
TSMC sees huge gains with its SoIC advanced packaging technology. Reports say Apple and AMD lead this growth surge. The tech differs from traditional SoCs and might appear in Apple chips this year. Higher-end M5 processors will likely use this TSMC packaging.

Apple has moved beyond just ordering chips from TSMC and started exploring SoIC packaging for its products. This brings better power use and other advantages. Economic News Daily reports that orders from Apple and AMD have pushed "explosive" growth in this area for TSMC. The company plans to increase SoIC production through late 2025. TSMC seems to be shifting focus from CoWoS packaging toward SoIC as customers want their next products built with this technology.

We might see results later this year when Apple adds SoIC packaging to M5 Pro chips in updated MacBook Pros. The base M5 model will miss out on this tech. SoIC allows two advanced chips to stack directly on each other with ultra-dense connections. This cuts delays, boosts performance, and makes chips more efficient. TSMC expects about 30 designs using SoIC between 2026 and 2027, with Apple possibly leading this new trend.
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