Apple fanboys might finally see genuine hardware innovation thanks to massive internal silicon upgrades. GF Securities analyst Jeff Pu claims the upcoming A20 Pro processor features radical architecture changes for the iPhone 18 Pro and the elusive iPhone Fold. This silicon apparently ditches InFO packaging for a Wafer-level Multi-Chip Module design. That shift allows engineers to stack the CPU and GPU vertically, while integrating RAM directly to save precious physical space.
Manufactured on the TSMC 2nm node, these chips also supposedly utilize Super-High-Performance Metal-Insulator-Metal capacitors. Pu believes this tech doubles density, while slashing electrical resistance. He expects Cupertino to ship roughly 250 million units...