A networking titan just dropped a 102.4-terabits-per-second switching chip built to handle AI cluster workloads at scale and slash energy waste in data centers.
Silicon One G300 chip targets AI infrastructure
Silicon One G300 chip targets AI infrastructure
- Cisco's new silicon will power upcoming Nexus 9000 and 8000 systems designed for training and inference.
- The chip hits 102.4 Tbps throughput to support massive distributed AI deployments.
- Hardware-level security is baked in, and the design allows future upgrades without infrastructure replacement.
- Intelligent Collective Networking features include shared buffers, path-based balancing, and proactive telemetry.
- Cisco claims 33% higher network utilization and 28% faster job completion versus non-optimized setups.
- Liquid-cooled and air-cooled 102.4T systems deliver nearly 70% energy efficiency improvement over prior generations.
- New 1.6T optics and 800G Linear Pluggable Optics cut optical power consumption by up to 50%.
- Overall switch power use drops by 30% with the new optics tech.
- The unified AI networking platform now includes AI job observability and Splunk integration.
- API-driven automation and AgenticOps use guided troubleshooting to simplify network management.
- Features aim to reduce operational complexity for sovereign and compliance-sensitive deployments.
- The G300 chip, systems, and optics are set to ship this year.
- Cisco is collaborating with NVIDIA, AMD, Intel, NetApp, DDN, and VAST on integrated AI stacks.