Thermodynamics just got a reality check because Frore Systems effectively froze a 1950W NVIDIA Rubin GPU. The company demonstrated the LiquidJet coldplate at the Las Vegas trade show to prove it can handle next-level thermal density. This hardware utilizes a multistage architecture with 3D short-loop jet channels that target specific hotspots on the processor.
One setup involved a single reticle chip pushing 600W per square centimeter. Engineers applied PTM 7950 thermal material to interface the silicon with the cooler. That configuration held the junction temperature at 94.1 degrees Celsius while staying safely under the maximum thermal limit.
The most impressive rig featured the dual-reticle Rubin unit paired with eight high-bandwidth memory stacks. Despite the absurd power draw, the chip stayed at 80.5 degrees Celsius with inlet liquid temperatures around 40 degrees. These results suggest the tech is ready for heavy data center workloads.
Scalability appears massive since the design reportedly supports 4400-watt processors like the future Feynmann generation. Frore Systems claims this method outperforms traditional liquid loops. The brand clearly intends to dominate the high-performance computing space before competitors catch up.
Consumer devices also received attention with the AirJet Mini G2 appearing inside a Qualcomm Snapdragon X2 Elite laptop. This solid-state active cooling chip dissipates 7.5 watts silently without mechanical parts. It creates enough back pressure to allow for dustproof and water-resistant chassis designs.
One setup involved a single reticle chip pushing 600W per square centimeter. Engineers applied PTM 7950 thermal material to interface the silicon with the cooler. That configuration held the junction temperature at 94.1 degrees Celsius while staying safely under the maximum thermal limit.
The most impressive rig featured the dual-reticle Rubin unit paired with eight high-bandwidth memory stacks. Despite the absurd power draw, the chip stayed at 80.5 degrees Celsius with inlet liquid temperatures around 40 degrees. These results suggest the tech is ready for heavy data center workloads.
Scalability appears massive since the design reportedly supports 4400-watt processors like the future Feynmann generation. Frore Systems claims this method outperforms traditional liquid loops. The brand clearly intends to dominate the high-performance computing space before competitors catch up.
Consumer devices also received attention with the AirJet Mini G2 appearing inside a Qualcomm Snapdragon X2 Elite laptop. This solid-state active cooling chip dissipates 7.5 watts silently without mechanical parts. It creates enough back pressure to allow for dustproof and water-resistant chassis designs.
