Global Unichip Corp just dropped a major tech bombshell by successfully creating the world's first HBM4 controller and PHY IP. Using TSMC's cutting-edge N3P process and advanced CoWoS-R packaging, they've engineered a breakthrough semiconductor component.
The new HBM4 IP blazes through data transmission at mind-blowing 12 Gbps speeds under every operating condition. Its clever interposer design maximizes signal and power integrity across different packaging technologies. Compared to HBM3, the new IP delivers a whopping 2.5x bandwidth boost, 1.5x better power efficiency, and double the area performance.
Teaming up with proteanTecs, GUC baked in advanced monitoring capabilities that provide deep insights into chip performance and reliability. The IP seamlessly integrates with their existing 32 Gbps UCIe-A and GLink-3D technologies, creating a comprehensive solution for cutting-edge AI and high-performance computing applications.
GUC's president, Sean Tai, couldn't contain his excitement about pushing semiconductor boundaries. By combining HBM4, UCIe-A, and GLink-3D technologies, they're offering semiconductor manufacturers a powerful toolkit to tackle the most demanding computational challenges across multiple industries.
The new HBM4 IP blazes through data transmission at mind-blowing 12 Gbps speeds under every operating condition. Its clever interposer design maximizes signal and power integrity across different packaging technologies. Compared to HBM3, the new IP delivers a whopping 2.5x bandwidth boost, 1.5x better power efficiency, and double the area performance.
Teaming up with proteanTecs, GUC baked in advanced monitoring capabilities that provide deep insights into chip performance and reliability. The IP seamlessly integrates with their existing 32 Gbps UCIe-A and GLink-3D technologies, creating a comprehensive solution for cutting-edge AI and high-performance computing applications.
GUC's president, Sean Tai, couldn't contain his excitement about pushing semiconductor boundaries. By combining HBM4, UCIe-A, and GLink-3D technologies, they're offering semiconductor manufacturers a powerful toolkit to tackle the most demanding computational challenges across multiple industries.
