Intel changed how it designs computer chips with its Arrow Lake system. The company now makes different parts called tiles that work together instead of one big piece. Each tile does a special job for the complete chip. The main computing tile comes from TSMC using their best N3B method. Other parts, like input-output tiles, use older TSMC N6 technology.
The base that holds everything together still comes from Intel factories. This marks the first time Intel has let another company make important parts of its chips. Arrow Lake puts energy-saving cores between high-performance cores to spread heat better across the chip. Four fast cores sit at the edges with groups of four efficient cores between them. This new layout helps keep the chip from getting too hot in one spot. All cores can use the shared 36MB memory cache, which helps even the smaller cores run faster. These changes show Intel trying new ways to keep up with the competition.
The base that holds everything together still comes from Intel factories. This marks the first time Intel has let another company make important parts of its chips. Arrow Lake puts energy-saving cores between high-performance cores to spread heat better across the chip. Four fast cores sit at the edges with groups of four efficient cores between them. This new layout helps keep the chip from getting too hot in one spot. All cores can use the shared 36MB memory cache, which helps even the smaller cores run faster. These changes show Intel trying new ways to keep up with the competition.
