Intel has emerged as a potential competitor to TSMC in advanced packaging technologies, with major tech companies showing interest in the chipmaker's EMIB and Foveros solutions. Recent job postings from Apple and Qualcomm indicate both firms are seeking engineers with expertise in Intel's packaging methods, suggesting possible adoption of these alternatives to TSMC's dominant CoWoS technology.
The interest stems partly from supply constraints at TSMC, where high demand from NVIDIA and AMD has created bottlenecks that affect newer clients seeking advanced packaging services. Intel's EMIB technology connects multiple chiplets using embedded silicon bridges rather than large interposers, while Foveros enables three-dimensional chip stacking. NVIDIA CEO Jensen Huang has previously praised Intel's Foveros capabilities.
Although the job listings do not confirm actual adoption, they signal growing industry consideration of Intel's packaging offerings as viable options for custom silicon development at companies, including Broadcom.
The interest stems partly from supply constraints at TSMC, where high demand from NVIDIA and AMD has created bottlenecks that affect newer clients seeking advanced packaging services. Intel's EMIB technology connects multiple chiplets using embedded silicon bridges rather than large interposers, while Foveros enables three-dimensional chip stacking. NVIDIA CEO Jensen Huang has previously praised Intel's Foveros capabilities.
Although the job listings do not confirm actual adoption, they signal growing industry consideration of Intel's packaging offerings as viable options for custom silicon development at companies, including Broadcom.
