Intel's VP of Corporate Planning, John Pitzer, hit up the UBS Global Technology and AI Conference to gas up the foundry business, saying their 18A process yields are getting better every month since CEO Lip-Bu Tan showed up. The company is cranking out Panther Lake chips right this second, and external customers are checking out both the 18A-P and 18A-PT nodes after seeing decent progress with the PDK stuff.
Advanced packaging is apparently blowing up for Intel Foundry because TSMC's CoWoS capacity was super tight, and companies started looking at EMIB and Foveros as backup options. Pitzer admitted they fumbled the ball a bit when the spillover demand first hit, but it got customers through the door for bigger strategic talks instead of just quick tactical ones.
The exec basically shut down any foundry spinoff rumors, pointing to all the interest around their chip manufacturing and packaging combo as proof the division can turn things around.
Advanced packaging is apparently blowing up for Intel Foundry because TSMC's CoWoS capacity was super tight, and companies started looking at EMIB and Foveros as backup options. Pitzer admitted they fumbled the ball a bit when the spillover demand first hit, but it got customers through the door for bigger strategic talks instead of just quick tactical ones.
The exec basically shut down any foundry spinoff rumors, pointing to all the interest around their chip manufacturing and packaging combo as proof the division can turn things around.
