Intel Foundry researchers have developed a modular heat spreader assembly technique that could enable the production of exceptionally large semiconductor packages while reducing manufacturing complexity and costs. The method separates traditional single-piece metal spreaders into simpler components joined during packaging, cutting warpage by 30 percent and thermal interface material gaps by 25 percent compared with conventional designs, according to a company research paper.
The disaggregated approach uses flat plates for heat distribution combined with stiffeners that provide structural support and cavity shapes, all manufactured through standard stamping rather than expensive machining processes. Engineers noted the system addresses limitations in current designs that struggle beyond 7,000 square millimeters, where complex stepped cavities become prohibitively difficult to produce. The technique also improves package flatness by 7 percent when stiffeners attach before chip installation.
Intel indicated the innovation supports its advanced packaging technologies involving multiple chiplet configurations and stacked layers, with potential adaptation for specialized thermal solutions, including liquid cooling integration.
The disaggregated approach uses flat plates for heat distribution combined with stiffeners that provide structural support and cavity shapes, all manufactured through standard stamping rather than expensive machining processes. Engineers noted the system addresses limitations in current designs that struggle beyond 7,000 square millimeters, where complex stepped cavities become prohibitively difficult to produce. The technique also improves package flatness by 7 percent when stiffeners attach before chip installation.
Intel indicated the innovation supports its advanced packaging technologies involving multiple chiplet configurations and stacked layers, with potential adaptation for specialized thermal solutions, including liquid cooling integration.
