Apple plans to integrate advanced Liquid Molding Compound technology into its 2026 MacBook Pro models powered by M5 processors. Taiwan-based Eternal Materials will serve as the exclusive supplier for this specialized material. The company selected this supplier after Eternal Materials outperformed Japanese competitors Namics and Nagase. This decision represents a strategic shift toward Taiwan-based suppliers for advanced chip materials. The move grants Apple greater flexibility in research partnerships and supply chain control.
The new compound prepares Apple's hardware for future Chip-on-Wafer-on-Substrate packaging standards used in high-performance computing applications. While 2026 models will not utilize full CoWoS technology, the compatible materials establish groundwork for future processor generations. The compound delivers improved heat management, structural durability, and manufacturing efficiency compared to current methods. These enhancements will enable consistent performance across demanding computational tasks. Future M6 and M7 processors may fully adopt CoWoS technology for enhanced processing capabilities.
The new compound prepares Apple's hardware for future Chip-on-Wafer-on-Substrate packaging standards used in high-performance computing applications. While 2026 models will not utilize full CoWoS technology, the compatible materials establish groundwork for future processor generations. The compound delivers improved heat management, structural durability, and manufacturing efficiency compared to current methods. These enhancements will enable consistent performance across demanding computational tasks. Future M6 and M7 processors may fully adopt CoWoS technology for enhanced processing capabilities.
