Sony released the PlayStation 5 CFI-2100 model in Europe this month with a reduced 825-gigabyte solid-state drive compared to the previous one-terabyte version. YouTuber Austin Evans conducted a teardown that revealed significant internal modifications addressing a widespread liquid metal cooling defect. The revision adds ridges similar to those found in the PlayStation 5 Pro to prevent cooling solution migration when users position consoles vertically.
The hardware update features three NAND modules rather than two, and eliminates the glossy exterior finish present on earlier slim designs. Earlier models suffered damage when liquid metal dripped away from the accelerated processing unit during vertical placement. Sony has not confirmed a United States launch date for this revision, but reports suggest a PlayStation 5 Pro update will follow with minor adjustments.
The hardware update features three NAND modules rather than two, and eliminates the glossy exterior finish present on earlier slim designs. Earlier models suffered damage when liquid metal dripped away from the accelerated processing unit during vertical placement. Sony has not confirmed a United States launch date for this revision, but reports suggest a PlayStation 5 Pro update will follow with minor adjustments.
