Japanese semiconductor manufacturer Rapidus begins experimental production of advanced 2nm wafers at its new IIM-1 facility. The company installed 200 pieces of advanced equipment and employs gate-all-around technology to compete with industry leaders Samsung and TSMC. Rapidus uses single-wafer processing methods that allow engineers to modify individual units and apply changes across entire production runs. This approach reduces costs while generating data that trains artificial intelligence systems to improve manufacturing yields. The strategy helps the company optimize production efficiency through machine learning algorithms.
Rapidus achieved rapid progress since establishing its semiconductor operations in September 2023. Workers completed clean room construction during 2024 and installed cutting-edge wafer production machinery by June 2025. The firm plans to release a Process Development Kit for customers during the first quarter of 2026. Clients will receive prototyping capabilities immediately after the kit becomes available. Mass production operations will commence in 2027 despite launching one year after competitors Samsung and TSMC.
Rapidus achieved rapid progress since establishing its semiconductor operations in September 2023. Workers completed clean room construction during 2024 and installed cutting-edge wafer production machinery by June 2025. The firm plans to release a Process Development Kit for customers during the first quarter of 2026. Clients will receive prototyping capabilities immediately after the kit becomes available. Mass production operations will commence in 2027 despite launching one year after competitors Samsung and TSMC.
