Samsung is cooking up a new sideways chip packaging tech to fight heat. The company is developing a side-by-side structure for future Exynos processors where the main chip die and the DRAM sit horizontally next to each other, topped with a Heat Pass Block. This layout supposedly allows both components to dissipate heat faster, improving thermals, while also reducing the overall thickness of the chip package.
This SbS packaging could enable thinner phone designs, potentially benefiting a future slim flagship like a revived Galaxy S Edge model or other OEMs using Samsung's 2nm manufacturing. It is unlikely to debut in the rumored Exynos 2600 for the Galaxy Z Flip 8, as that chip probably uses existing packaging. The technology is more probable for a later chip, possibly the Exynos 2700 or the Exynos 2800, which is expected to feature Samsung's first fully in-house GPU and target devices beyond just smartphones.
This SbS packaging could enable thinner phone designs, potentially benefiting a future slim flagship like a revived Galaxy S Edge model or other OEMs using Samsung's 2nm manufacturing. It is unlikely to debut in the rumored Exynos 2600 for the Galaxy Z Flip 8, as that chip probably uses existing packaging. The technology is more probable for a later chip, possibly the Exynos 2700 or the Exynos 2800, which is expected to feature Samsung's first fully in-house GPU and target devices beyond just smartphones.
