Apple plans to launch the world's first 2nm chips next year. The company will reveal these chips when it shows off the A20 and A20 Pro processors. These chips will power the iPhone 18 series. Apple wants to be first to market with this cutting-edge technology. The move puts Apple ahead of other phone makers.
The tech giant will switch to two different chip packaging methods starting 2026. Apple chose WMCM packaging for the A20 and A20 Pro chips. The company picked SoIC packaging for its server processors. TSMC will handle both packaging types at separate facilities. Each packaging method offers unique benefits for different chip types.
WMCM packaging lets Apple combine multiple chip parts at the wafer stage. Engineers can mix CPU, GPU, memory, and other components before cutting them into individual chips. This method keeps the chip size small but adds more features. The process makes chips smaller and more power efficient. Apple can mass produce these advanced processors more easily.
TSMC will build dedicated production lines for Apple's new chips. The P1 facility will make 10,000 wafers per month for the A20 series. The AP6 facility will focus on server chip production. SoIC packaging stacks two advanced chips directly on top of each other. This creates faster connections between chips and reduces delays.
The tech giant will switch to two different chip packaging methods starting 2026. Apple chose WMCM packaging for the A20 and A20 Pro chips. The company picked SoIC packaging for its server processors. TSMC will handle both packaging types at separate facilities. Each packaging method offers unique benefits for different chip types.
WMCM packaging lets Apple combine multiple chip parts at the wafer stage. Engineers can mix CPU, GPU, memory, and other components before cutting them into individual chips. This method keeps the chip size small but adds more features. The process makes chips smaller and more power efficient. Apple can mass produce these advanced processors more easily.
TSMC will build dedicated production lines for Apple's new chips. The P1 facility will make 10,000 wafers per month for the A20 series. The AP6 facility will focus on server chip production. SoIC packaging stacks two advanced chips directly on top of each other. This creates faster connections between chips and reduces delays.
