Apple secures nearly half of TSMC's initial 2nm wafer production capacity as the foundry prepares for fourth-quarter manufacturing. The tech company plans four different processors using the advanced lithography process. These chips will power multiple product lines launching in 2026.
The A20 and A20 Pro processors will drive the iPhone 18 series and utilize new WMCM packaging technology. This wafer-level multi-chip module approach integrates CPU, GPU, and memory components within smaller footprints. The design delivers enhanced performance while reducing heat generation and extending battery life.
Apple's M6 processor will equip future MacBook Pro models that may feature OLED displays replacing mini-LED screens. The company also develops an R2 co-processor for the next Apple Vision Pro headset scheduled for 2026 release. TSMC expects to produce 100,000 wafers monthly by late 2026, charging approximately $30,000 per wafer for the premium manufacturing process.
The A20 and A20 Pro processors will drive the iPhone 18 series and utilize new WMCM packaging technology. This wafer-level multi-chip module approach integrates CPU, GPU, and memory components within smaller footprints. The design delivers enhanced performance while reducing heat generation and extending battery life.
Apple's M6 processor will equip future MacBook Pro models that may feature OLED displays replacing mini-LED screens. The company also develops an R2 co-processor for the next Apple Vision Pro headset scheduled for 2026 release. TSMC expects to produce 100,000 wafers monthly by late 2026, charging approximately $30,000 per wafer for the premium manufacturing process.
