Apple plans to introduce A20 and A20 Pro processors manufactured on TSMC's 2nm technology for the iPhone 18 series. Each wafer produced through this advanced process costs approximately $30,000, making Apple among the few companies capable of adopting this expensive manufacturing method. The company will transition from InFO packaging to Multi-Chip Module Packaging by 2026 to reduce expenses and enhance performance capabilities. Analyst Ming-Chi Kuo reports this shift represents Apple's strategy to manage rising production costs.
The WMCM packaging technology employs Molding Underfill processes that integrate underfill and molding operations simultaneously. This approach reduces material usage while improving manufacturing yields and operational efficiency. TSMC currently achieves 60 percent yields during 2nm trial production runs, though final production numbers remain uncertain. Apple separately explores System on Integrated Chips technology for future M5 processors destined for MacBook Pro models. This stacking method creates ultra-dense chip connections that decrease latency and boost overall system performance.
The WMCM packaging technology employs Molding Underfill processes that integrate underfill and molding operations simultaneously. This approach reduces material usage while improving manufacturing yields and operational efficiency. TSMC currently achieves 60 percent yields during 2nm trial production runs, though final production numbers remain uncertain. Apple separately explores System on Integrated Chips technology for future M5 processors destined for MacBook Pro models. This stacking method creates ultra-dense chip connections that decrease latency and boost overall system performance.
