Intel leaders think new chip designs could reduce demand for expensive machines. Advanced etching tools may become more important than lithography equipment. Current chip makers rely heavily on ASML machines that cost millions of dollars. Future transistor types called GAAFET and CFET need different manufacturing steps. These designs wrap gates around components rather than placing them on top.
Etching removes material from wafers after patterns are printed on silicon. New transistor designs require more sideways cutting compared to older methods. Companies must remove excess material from all directions around tiny components. This process takes more time and specialized equipment than before. Manufacturers focus on vertical stacking to save space on each chip.
Intel experts believe high-end EUV machines will matter less for future products. Older chip designs needed precise printing to create small features. Newer approaches achieve density through better material removal techniques. Engineers can stack transistor groups vertically instead of making them smaller. This method reduces dependence on the most advanced printing equipment available today.
Etching removes material from wafers after patterns are printed on silicon. New transistor designs require more sideways cutting compared to older methods. Companies must remove excess material from all directions around tiny components. This process takes more time and specialized equipment than before. Manufacturers focus on vertical stacking to save space on each chip.
Intel experts believe high-end EUV machines will matter less for future products. Older chip designs needed precise printing to create small features. Newer approaches achieve density through better material removal techniques. Engineers can stack transistor groups vertically instead of making them smaller. This method reduces dependence on the most advanced printing equipment available today.
