Intel lands US chip giants for packaging push

Intel Foundry is emerging as a potential provider of advanced packaging services for several major US technology firms. Reports indicate that companies such as Microsoft, Tesla, Qualcomm, and NVIDIA, which currently place chip orders with TSMC’s Arizona facility, are considering Intel for the subsequent packaging stage. This development opens a significant new business avenue for Intel’s foundry division.

The United States is actively building a self-reliant semiconductor supply chain, yet it currently possesses limited domestic packaging capabilities. Intel’s extensive portfolio of advanced packaging technologies positions it to address this gap. The recent hiring of former TSMC executive Dr. Wei-Jen Lo is seen as a strategic move to align Intel’s packaging services with the expectations of leading US fabless companies.

This potential collaboration could allow clients to complete both manufacturing and packaging within Arizona, avoiding the current necessity of shipping wafers overseas. Such an arrangement would reduce costs and lead times, strengthening the onshore supply chain. While TSMC plans its own US-based packaging facilities, a partnership with Intel offers an interim solution to meet immediate industry demand.