Samsung has recruited Gang Duan, a former Intel principal engineer who specialized in substrate packaging technology for over seventeen years. Duan accepted the position of Executive VP for Packaging Solutions, marking a significant career advancement. His expertise centers on glass substrates and EMIB technology, areas where he earned recognition as Inventor of the Year in 2024. The engineer accumulated nearly 500 patent applications during his tenure, focusing on silicon die combinations and interconnect innovations. His departure represents a major talent acquisition for Samsung.
Intel recently discontinued its glass substrate development program despite maintaining a technological advantage over competitors for several years. The company had planned to implement this technology in packaging services by late 2025, while rivals remained in early development stages. Internal sources confirmed Intel's leadership position in this field before the program cancellation. Duan's move to Samsung demonstrates how Intel's cost-cutting measures may sacrifice long-term technological advantages. This decision could compromise Intel's future competitiveness in advanced packaging solutions.
Intel recently discontinued its glass substrate development program despite maintaining a technological advantage over competitors for several years. The company had planned to implement this technology in packaging services by late 2025, while rivals remained in early development stages. Internal sources confirmed Intel's leadership position in this field before the program cancellation. Duan's move to Samsung demonstrates how Intel's cost-cutting measures may sacrifice long-term technological advantages. This decision could compromise Intel's future competitiveness in advanced packaging solutions.
