Japanese chip manufacturer Rapidus announced on Thursday that major American companies have expressed interest in its 2nm semiconductor process. Chief Executive Atsuyoshi Koike stated IBM and Tenstorrent will produce customer product prototypes beginning in 2026, and additional contracts remain possible.
IBM has collaborated with Rapidus on 2nm node development through packaging technology and joint research support. Tenstorrent operates under Chief Executive Jim Keller, who previously held senior positions at Intel and AMD, and the company specializes in RISC-V architecture for artificial intelligence applications.
Rapidus plans to deliver process design kits to customers by the first quarter of 2026, and mass production could begin in late 2026 or early 2027. The timeline positions Rapidus ahead of competitors such as TSMC and Intel for similar node sizes.
IBM has collaborated with Rapidus on 2nm node development through packaging technology and joint research support. Tenstorrent operates under Chief Executive Jim Keller, who previously held senior positions at Intel and AMD, and the company specializes in RISC-V architecture for artificial intelligence applications.
Rapidus plans to deliver process design kits to customers by the first quarter of 2026, and mass production could begin in late 2026 or early 2027. The timeline positions Rapidus ahead of competitors such as TSMC and Intel for similar node sizes.
