According to TechInsights research, Intel takes the lead in chip performance with its new 18A node. The company scored 2.53 on a performance scale, ahead of TSMC N2 at 2.27 and Samsung SF2 at 2.19. These numbers make Intel the top performer among cutting-edge two-nanometer class nodes. The 18A design includes a Backside Power Delivery Network, which represents a major change in how power reaches the transistors.
This new power layout makes chips more efficient and helps parts work better together. Early test chips will appear in Panther Lake processors late next year, with regular production starting in early 2026. The 18A process uses 15% less power than the older Intel 3 technology and fits 30% more transistors in the same space. Intel has already begun small-scale manufacturing to test the process before ramping up production.
Memory cells have also shrunk significantly, with high-performance SRAM cells decreasing from 0.03 to 0.023 square micrometers. The special power delivery approach solved voltage problems and freed up space for transistors. This resulted in a memory density of 38.1 megabits per square millimeter, putting Intel neck-and-neck with TSMC.
This new power layout makes chips more efficient and helps parts work better together. Early test chips will appear in Panther Lake processors late next year, with regular production starting in early 2026. The 18A process uses 15% less power than the older Intel 3 technology and fits 30% more transistors in the same space. Intel has already begun small-scale manufacturing to test the process before ramping up production.
Memory cells have also shrunk significantly, with high-performance SRAM cells decreasing from 0.03 to 0.023 square micrometers. The special power delivery approach solved voltage problems and freed up space for transistors. This resulted in a memory density of 38.1 megabits per square millimeter, putting Intel neck-and-neck with TSMC.
