TSMC plans three new 2nm plants

The world's dominant chipmaker finds itself stretched beyond capacity as executives acknowledge production facilities cannot satisfy surging orders for cutting-edge silicon. Leadership at the Taiwan-based manufacturer has greenlit construction of three massive fabrication plants dedicated to 2-nanometer wafer output, committing an eye-watering $28.6 billion to the expansion effort. Each facility will consume roughly $9.54 billion in startup capital and will rise within the Southern Taiwan Science Park Special Zone, supplementing seven existing locations in Hsinchu and Kaohsiung that have reached operational limits.

The aggressive buildout comes as Apple gobbles up more than half the available 2-nanometer supply for smartphone processors destined for handsets arriving in 2026, leaving rivals Qualcomm and MediaTek scrambling for remaining capacity. Meanwhile, the semiconductor giant pours another $49 billion into its A14 plant in Taichung, where even smaller 1.4-nanometer production will eventually commence, cementing its position as the sole manufacturer capable of delivering chips at such microscopic scales.
 

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