Apple might use Intel for packaging its custom AI server chips due to a shortage at TSMC. The chip, codenamed Baltra and developed with Broadcom, was originally slated for 2027 but could now ship in 2028. The plan is to employ Intel's EMIB packaging tech because TSMC's own advanced CoWoS packaging capacity is completely maxed out.
This follows earlier reports that Apple is also evaluating Intel's cutting-edge 18A P manufacturing process for future lower-end iPhone and Mac chips. That Intel node supports advanced three-dimensional chip stacking. Intel is reportedly setting up a new business unit specifically to make custom AI chips for other companies, capitalizing on the industry-wide demand and TSMC's packaging bottleneck.
This follows earlier reports that Apple is also evaluating Intel's cutting-edge 18A P manufacturing process for future lower-end iPhone and Mac chips. That Intel node supports advanced three-dimensional chip stacking. Intel is reportedly setting up a new business unit specifically to make custom AI chips for other companies, capitalizing on the industry-wide demand and TSMC's packaging bottleneck.
