TSMC started taking orders for its 2nm wafers but chips won't arrive until late next year. Apple jumped on the chance to use this new tech first with its A20 processor. The company plans to make the A20 using WMCM packaging technology. Only the iPhone 18 Pro, iPhone 18 Pro Max and Apple's foldable phone will use this advanced chip.
Apple won't add more RAM to any iPhone model that comes with the A20 processor. The WMCM packaging helps Apple keep the chip small but pack more power inside. Engineers can combine different parts like the CPU and GPU at the wafer level before cutting them into separate chips. This method creates smaller processors that use less battery but run faster than before.
China Times says the A20 will power the iPhone 18 Pro models and the iPhone 18 Fold. TSMC will build these special chips at its Chiayi AP7 facility starting production of 50,000 pieces monthly by late 2026. Apple will stick with 12GB of RAM for these phones. The A20 should run 15 percent faster than the A19 at the same power level. Regular iPhone 18 models might use older packaging methods to save money.
Apple won't add more RAM to any iPhone model that comes with the A20 processor. The WMCM packaging helps Apple keep the chip small but pack more power inside. Engineers can combine different parts like the CPU and GPU at the wafer level before cutting them into separate chips. This method creates smaller processors that use less battery but run faster than before.
China Times says the A20 will power the iPhone 18 Pro models and the iPhone 18 Fold. TSMC will build these special chips at its Chiayi AP7 facility starting production of 50,000 pieces monthly by late 2026. Apple will stick with 12GB of RAM for these phones. The A20 should run 15 percent faster than the A19 at the same power level. Regular iPhone 18 models might use older packaging methods to save money.
